摘要 Abstract 

因應產品微型化的趨勢，預計產出異質封裝整合之影像運算模組，生產方式係將FPGA InFO晶片與電容做Re-package，進而產出異質影像運算晶片，成品將比傳統的BGA封裝面積更小、厚度更薄。再將上述產出之模組及影像處理技術落實於M.2加速卡，以利工業電腦廠商測試後採用。

According to the miniaturization trend of products, it is expected to produce the heterogeneous packaging integrated image computing modules. The production method is to combine FPGA InFO chips and capacitor as Re-package, and then produce the heterogeneous image computing chip. The completed chip will be smaller and thinner than the traditional BGA package. Finally, it is supposed to implement the above-mentioned computing modules and the image processing technology on the M.2 accelerator card, so that industrial computer manufacturers can adapt it after testing.