Abstract 

According to the miniaturization trend of products, it is expected to produce the heterogeneous packaging integrated image computing modules. The production method is to combine FPGA InFO chips and capacitor as Re-package, and then produce the heterogeneous image computing chip. The completed chip will be smaller and thinner than the traditional BGA package. Finally, it is supposed to implement the above-mentioned computing modules and the image processing technology on the M.2 accelerator card, so that industrial computer manufacturers can adapt it after testing.